Diamond Wire, also known as diamond cutting wire, is specially used for cutting photovoltaic silicon wafers, sapphire, magnetic materials and silicon carbide crystals. Its supporting chemicals fall into two major systems: surface treatment chemicals for diamond wire, and grinding chemicals for wafer slicing. These special chemical agents are indispensable in both diamond wire manufacturing and silicon wafer slicing processes.
We offer phosphorus-free and boron-free film agents to help steel strand enterprises meet environmental protection emission standards
We offer phosphorus-free and boron-free film agents to help steel strand enterprises meet environmental protection emission standards
Hold the three major international system certifications of ISO 9001, ISO 14001 and ISO 45001. We own over 20 patented technologies
Remove rolling oil and impurities on the wire surface
Strip iron scale and rust spots, and prevent over-corrosion of steel wire substrate
Form a porous phosphate conversion film on the steel wire surface
Neutralize residual acid on workpieces, and provide a high-adhesion base for the subsequent nickel-diamond coating.
We provide comprehensive wire production chemical solutions to global customers—from high-performance phosphating solutions to advanced dry wire drawing lubricants.
